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NTMFS4837N
Power MOSFET
30 V, 74 A, Single N ? Channel, SO ? 8FL
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? These are Pb ? Free Devices
http://onsemi.com
Applications
? Refer to Application Note AND8195/D
? CPU Power Delivery
? DC ? DC Converters
? Low Side Switching
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
R DS(ON) MAX
5.0 m W @ 10 V
7.5 m W @ 4.5 V
D (5,6)
I D MAX
74 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
V GS
± 20
V
G (4)
Continuous Drain
Current R q JA
(Note 1)
Power Dissipation
R q JA (Note 1)
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
16
11.5
2.2
A
W
S (1,2,3)
N ? CHANNEL MOSFET
S
4837N
AYWZZ
S
G
D
Continuous Drain
Current R q JA
(Note 2)
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC
(Note 1)
Power Dissipation
R q JC (Note 1)
Pulsed Drain
Current
Steady
State
t p =10 m s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
T A = 25 ° C
ID
P D
I D
P D
I DM
10
7
0.88
74
53
47.2
148
A
W
A
W
A
1
SO ? 8 FLAT LEAD
CASE 488AA
STYLE 1
A = Assembly Location
Y = Year
W = Work Week
S
MARKING
DIAGRAM
D
D
D
Operating Junction and Storage Temperature
Source Current (Body Diode)
T J ,
T STG
I S
? 55 to
+150
39
° C
A
ZZ
= Lot Traceability
Drain to Source dV/dt
dV/dt
6
V/ns
ORDERING INFORMATION
Single Pulse Drain ? to ? Source Avalanche EAS 242 mJ
Energy (V DD = 30 V, V GS = 10 V,
I L = 22 A pk , L = 1.0 mH, R G = 25 W)
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8” from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device Package Shipping ?
NTMFS4837NT1G SO ? 8FL 1500 /
(Pb ? Free) Tape & Reel
NTMFS4837NT3G SO ? 8FL 5000 /
(Pb ? Free) Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 6
1
Publication Order Number:
NTMFS4837N/D
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